Design, Simulation and Modelling Engineer for Advanced Semiconductor Packaging (SiPFAB) / Mallinnus-insinööri (SiPFAB)

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edge in technology, health and society. www.tuni.fi/en

Tampere University System-in-Package Fabrication (SiPFAB) is now looking for a Simulation Engineer.

System-in-Package Fabrication (SiPFAB) is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences (ITC) of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions.

SiPFAB enables the development and experimentation of future-oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot-scale development of emerging chip technologies that drive energy-efficient solutions for industrial applications in transportation and energy systems. SiPFAB offers research and development services, piloting opportunities, and expert support across all stages of chip integration and packaging for the industry— from concept to prototype and pre-production.

SiPFAB is part of the Chips JU Wide Band Gap Pilot Line, which contributes to the European objective of strengthening the semiconductor technology and manufacturing ecosystem.

WBG Pilot Line infrastructures

The national nodes of the WBG Pilot line will host different cleanroom facilities enabling the transition from research to industrial-scale production in the WBG and Ultra-WBG semiconductor technologies, consolidating Europe's autonomy in the semiconductor sector. Read more about the WBG Pilot Line

JOB DESCRIPTION

SiPFAB is looking for an experienced Design, Simulation and Modelling Engineer. As a Simulation Engineer specializing in the modelling and simulation of power and RF semiconductor packaging, you will lead the development of SiPFABs design, modelling and simulation processes and methods. Working as part of a multidisciplinary team, you will contribute directly to customer projects spanning academia, research institutes, and industry driving the demonstration, maturation, and commercialization of advanced packaging technologies.

In this role, you will also play a key part in defining software tools used at SiPFAB, exploring novel AI driven design and simulation methodologies and have the freedom to explore novel solutions for semiconductor packaging applications ensuring a robust and scalable design process for SiPFAB.

Your Key Responsibilities

- Establishing, developing, and optimizing design, simulation and modelling processes for semiconductor packaging applications

- Actively contributing to ongoing and future R&D and customer projects

- Engaging and collaborating with academic, RTO, and industrial partners

- Establishing Assembly Design Kits

- Create, modify, and verify mask layouts for semiconductor packaging processes using industry-standard CAD/layout tools

- Selecting, specifying, and procuring software tools

- Exploring and developing the use of AI in semiconductor packaging simulation and design

- Upkeep of software tooling

- Working closely with software vendors to advance simulation and design capability

- Training of new users

✅REQUIREMENTS

You are a proactive engineer who enjoys problem solving and working with different stakeholders.

Required Skills & Experience

- M.Sc. or Ph.D. in an applicable field such as Electrical or Process Engineering, Physics, Materials Science or Semiconductor Packaging Technology

- At least 5 years of relevant work experience

- Proven experience in semiconductor simulation, modelling and/or design

- A strong, structured approach to problem solving and troubleshooting

- Ability to work effectively in conditions of ambiguity where processes and tools are still evolving

- A team player with strong communication and collaboration skills

- High attention to detail and process discipline

- Fluent spoken and written skills in English

Considered as an asset

- Experience in the semiconductor or microelectronics industry

- Background in pilot-line environments or lab-to-production transitions

- Interest in following and understanding trends in the semiconductor packaging industry

- Knowledge of the Finnish language

Tampere University is a unique, multidisciplinary and boldly forward-looking, evolving community. Our values are openness, diversity, responsibility, courage, critical thinking, erudition, and learner-centeredness. We expect you to embrace these values and promote them in your work.

🎁WE OFFER

At SiPFAB, you will be working at the forefront of European semiconductor development and manufacturing initiatives. We offer a high-autonomy environment designed for proactive, self-driven engineers and opportunities for substantial impact and visibility within both the organization and wider ecosystem. In addition, we offer direct collaboration with researchers, industry partners, and the semiconductor community. This is a key role in shaping and demonstrating breakthrough packaging technologies.

At SiPFAB, you will get enthusiastic and awesome colleagues to work with. As a member of staff at Tampere University, you will enjoy a range of competitive benefits, such as a flexible work schedule, good facilities for teleworking, occupational healthcare services, a variety of affordable food and drink outlets across our campuses and a personal fund to spend on sports and cultural activities in your free time. Please read more about working at Tampere University. You can also find more information about us and working and living Tampere by watching our video: Tampere Higher Education Community - our academic playground

The positions will be filled on permanent basis, commencing preferably